Wavetek provides DC/RF test program development with solid experience to the customer for probe cards ordering and on-wafer testing.
Test data can be binned according to the packaging house's requirements.
Our on-wafer test solution provides customers with the complete & efficient one-stop foundry turnkey services.

Testing capabilities and services summary

DC test system

  • PCM Testing System
  • CP probing test system

CP probing test services

RF testing services

  • Wafer level DC and S-parameter characterization
  • Wafer level and board level load pull measurement
  • Wafer level noise pull measure ment and noise parameter extraction

DC Test System

PCM Testing System : HP4062C
  • System Features
    • 41421B MPSMU X3
    • 41420A HPSMU  X1 (200V for breakdown)
    • 4284 CV Meter
    • 8 Pins Switch Matrix
    • Tel-P8 Probe Station
  • Highly Accurate and Reliable Measurement Capabilities
    • Van Der Pauw /Four-Point TLM Method For Resistivity Measurement
    • errite Bead For Device Anti-Osc
  • Standard Networking
    • Clients /Server
    • EDA system
CP probing test system

Tester : Teradyne J750EX & J750
Prober : Accretech (TSK) UF200

  • Low Cost, High Efficiency Parallel Test
  • Prober System Features
    • I/O Channels: Up to 512
    • Data Rate: Up to 200 MHz /400 Mbps

CP Probing Test Services

  • Test program development
  • Test program conversion
  • Test probecard manufacturing
  • Mass production test

RF testing services

  • Wafer level DC and S-parameter characterization

    Capable for freq. from 10MHz to 110GHz

  • Wafer level noise pull measurement and noise parameter extraction
    • Up to 65GHz small signal and 50GHz noise parameter measurement capability
  • Wafer level and board level load pull measurement
    • Up to 4W (4GHz) / 1W (6~18GHz) power handling for one and two tone measurement
    • Tuner VSWR up to 50:1